TECHMAN ROBOT UNVEILS HIGH-PAYLOAD AI COBOT TM30S AT AUTOMATE

Release Time：08 May,2024

<p style="text-align: center;"><img src="/ueditor/php/upload/image/20240508/1715175763582047.png" title="1715175763582047.png" alt="6.png"/></p><p style="text-align: justify;"><span style="font-family: arial, helvetica, sans-serif; font-size: 12px;">Techman Robot&nbsp;has launched the&nbsp;TM30S&nbsp;robotic arm. This heavy-payload AI collaborative robot (cobot) has a maximum payload capacity of 35kg.</span></p><p style="text-align: justify;"><span style="font-family: arial, helvetica, sans-serif; font-size: 12px;">The TM30S is an extension of the TM AI cobot series, now catering to even higher payloads. With the ability to carry up to 35kg and boasting a reach of 1702mm across six joints, the TM30S offers the best “reach-to-weight” ratio compared to other cobots in the 30kg category. Its reach, coupled with its robust carrying capacity, positions the TM30S as a good solution for palletizing applications.</span></p><p style="text-align: justify;"><span style="font-family: arial, helvetica, sans-serif; font-size: 12px;">Efficient AI mixed depalletizing with TM30S<br/>Equipped with built-in smart vision and a 3D camera, TM30S utilizes 3D and AI recognition technology to instantly detect the size and position information. This technology allows the robot to arrange items without the need for pre-specified stacking patterns, handling complex scenarios like tilting, fitting, and tape wrapping, thus achieving efficient AI mixed depalletizing.</span></p><p style="text-align: justify;"><span style="font-family: arial, helvetica, sans-serif; font-size: 12px;">Suited for challenging heavy-duty automation<br/>This robot’s versatility makes it well-suited for a wide range of challenging tasks involving palletizing and packaging, massive pick-and-place jobs, material handling, and heavy machine tending. The TM30S is particularly effective for specific applications such as semiconductor backend processes, which demand substantial manual labor for loading, unloading, and lifting wafer boxes that weigh up to 35kg.</span></p><p style="text-align: justify;"><span style="font-family: arial, helvetica, sans-serif; font-size: 12px;">TM30S is a fully functional smart collaborative robot with powerful AI. It has smarter vision, peripheral software integration, and a more intuitive user interface. The TM30S leverages the next generation of AI to provide automated production efficiency in smart manufacturing.</span></p><p><br/></p>